Dmc 2d Matrix Set-Up

CHANGE RECORD

REV ORIGINATOR DATE DESCRIPTION OF CHANGE AFFECT STD TIME/-MAT’L

A1 Guo Xiangyu Initial Release of Document No

1. PURPOSE 4

2. SCOPE 4

3. RESPONSIBILITY 4

4. DEFINTION 4

5. REFERENCE DOCUMENT 4

5.1 Related Document 4

5.2 Forms to Use 4

6. EQUIPMENT AND MATERIALS 5

6.1 Equipment 5

For Probe Card: 5

For Probe Pin: 5

6.2 Supporting Accessories 5

7. PROCEDURE 6

7.1 Safety Precaution 6

7.2 PM Frequency 6

7.3 Equipment Power Up/Down and Buy-Off Procedure 10

7.4 Probe-core Off-line Cleaning with Brush 10

8. ACCEPTANCE CRITERIA 12

9. DISPOSAL OF WASTE/SCRAP MATERIALS (IF APPLICABLE) 12

10. RECORDS 12

11. OTHERS 12

12. APPENDIX 12

1. Purpose

This document shall specify all relevant controls and key practises for the maintenance of Accretech UF200R Wafer Probing System. It is intended to give a common understanding for all personnel involved in the routine PM.

2. Scope

This document is used for SIN SAW O FE P –Lift-Off Technology

3. Responsibility

SIN SAW O FE E is responsible for the correctness of this document.

SIN SAW O FE P and SIN SAW O FE E (Maintenance) are responsible to carry out production practices according to this document.

4. Defintion

N/A

5. Reference Document

5.1 Related Document

5.1.1 Production Lot Card

5.1.2 Control Plan (Sample/Pilot/Series) for Lift-off R9001-xx

5.1.3 Control Plan (Sample/Pilot/Series) for UBM R9136-xx

5.1.4 Control Plan (Sample/Pilot/Series) for Elpas R9107-xx

5.1.5 Control Plan (Sample/Pilot/Series) for PSN R9149-xx

5.1.6 Control Plan (Sample/Pilot/Series) for TRM R9196-xx

5.1.7 Process Control – Lift-Off – Wafer Probing Probecard RJM12-xx

5.1.8 Process Control – UBM– Wafer Probing Probecard RMF11-xx

5.1.9 Process Control – PSN– Wafer Probing Probecard R9149-xx

5.1.10 Process Control - ELPAS-Wafer Probing-ElectroGlas RG411-xx

5.1.11 Process Control – TRM– Wafer Probing Probecard RT811-xx

5.1.12 Work Instruction – FE – Wafer Probing Electroglas 4090µ+ RJM22-xx

5.1.11 Cleanroom Protocol R9005-xx

5.1.12 Wartung Downtime Entry Procedure R9035-xx

5.1.13 Wafer Fab Production Tools and Accessories Work Instruction and Maintenance R9125-xx

5.1.14 Waste Management G9031-xx

5.2 Forms to Use

5.2.1 Wafer Probing Accretech UF200R - Monthly PM RJM32-01-xx

6. Equipment and Materials

6.1 Equipment

For Probe Card:

S/N, P/N Equipment/Material Description

Accretech UF200R Wafer Prober Accretech UF200R

Manufacturer: Accretech

ZVT8 1300.0000K08 Rohde & Schwarz Network Analyser ZVT8-8Port (300 kHz – 8 GHz)

ZV-Z58 1164.0638.38 Calibration Unit (300 kHz – 8 GHz; 8 ports, 3.5mm(f))

Probecard Cascade Microtech Pyramid Probecards (Filtertype dependent; Pyramid Probe core and PCB)

HUBER SUHNER Connectors K02252D08/11SMA/16SMA/400MM With Brown sleeves (Connectors from connector holder to connection ports of Probecard; right side)

K02252D08/11SMA/16SMA/400MM With Red sleeves (Connectors from connector holder to connection ports of Probecard; left side)

SF104/16N44/24SMA451/2000MM (Connectors from NWA to connector holder)

6.2 Supporting Accessories

S/N, P/N Accessories Description

778927-01 GPIB-USB-HS, NI-488.2 for Windows Vista/2000/XP

HUBER SUHNER 74 Z-0-0-21 Torque Wrench

Flat Aligner

Cleanroom Gloves and Tools

Basic tools: Screw driver, Allen keys, IPA, Cleanroom Wipes and Vinyl Gloves.

7. Procedure

7.1 Safety